Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tien-Fu Liao0
Chih-Sung Chang0
Tzer-Perng Chen0
Date of Patent
March 28, 2006
0Patent Application Number
109179500
Date Filed
August 13, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A soft transparent adhesive layer is utilized to bond a transparent substrate material onto an AlGaInP light-emitting diode epitaxy on a GaAs substrate, and the GaAs substrate is next removed entirely. Then, a mesa etching process is performed to form a first top surface and a second top surface on the AlGaInP light-emitting diode epitaxy for respectively exposing an n-type layer and a p-type layer in the AlGaInP light-emitting diode epitaxy. Next, a metal reflective layer and a barrier layer are formed on the AlGaInP light-emitting diode epitaxy in turn, and electrodes are finally fabricated on the barrier layer.
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