US Patent 7022391 Packaging material for electronic-part case, and others

The present invention provides a casing material for an electronic component which has a good adhesion with an aluminum foil and a resin layer, impermeability of steam, heat seal property, and corrosion resistance for an electrolyte. The present invention also provides a casing for an electronic component using the casing material. The present invention also provides an electronic component including the casing. The casing material comprises a heat resistant resin drawn film layer as an outer layer, a thermoplastic resin not-drawn film as an inner layer, and an aluminum foil layer provided between the layers. In particular, an acrylic polymer layer is provided between the aluminum foil layer and the not-drawn film layer.