Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ming Xi0
Paul Frederick Smith0
Jenny C. Lin0
Christophe Marcadal0
Fusen Chen0
Ling Chen0
Mei Chang0
Michael X. Yang0
Date of Patent
April 11, 2006
0Patent Application Number
100526810
Date Filed
January 17, 2002
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Embodiments of the present invention provide a process sequence and related hardware for filling a patterned feature on a substrate with a metal, such as copper. The sequence comprises first forming a reliable barrier layer in the patterned feature to prevent diffusion of the metal into the dielectric layer through which the patterned feature is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the barrier layer at the bottom of the patterned feature, depositing a second barrier layer, and then filling the patterned feature with a metal, such as copper.
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