US Patent 7037752 Semiconductor device and manufacturing method thereof
All edits
Edits on 13 Dec, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 19 Nov, 2023
Golden AI
Edits made to:
Infobox (+13 properties)
Article (+610 characters)
Article
Patent abstract
A technique for manufacturing a low-cost, small volume, and highly integrated semiconductor device is provided. A characteristic of the present invention is that a semiconductor element formed by using a semiconductor thin film is transferred over a semiconductor element formed by using a semiconductor substrate by a transfer technique in order to manufacture a semiconductor device. Compared with the conventional manufacturing method, mass production of semiconductor devices with lower cost and higher throughput can be realized, and production cost per semiconductor device can be reduced.
Infobox
Is a
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hideaki Kuwabara0
Junya Maruyama0
Shunpei Yamazaki0
Toru Takayama0
Yumiko Ohno0
Yuugo Goto0
Date of Patent
May 2, 2006
0Patent Application Number
107404220
Date Filed
December 22, 2003
0Patent Primary Examiner
Golden AI
Edits made to:
US Patent 7037752 Semiconductor device and manufacturing method thereof
Find more entities like US Patent 7037752 Semiconductor device and manufacturing method thereof
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
