US Patent 7043880 In situ molded thermal barriers

The invention provides methods, systems, and devices for installing thermal barriers in openings or gaps in or between structures such as walls, ceilings, and floors. At least one thermal barrier molding bag is positioned in the hole or gap, and a flowable firestop material that is operative to cure or harden, such as a hydratable cementitious slurry, is introduced into the bag to mold a barrier in the hole or gap.