Patent attributes
An enclosure thermal shield (10) has a thermally insulated open container (12), a thermally insulated closure member (14), a thermally conductive liner (16) along the container's inner surface and along the inner surface of the closure member (14) forming a thermal circuit when the closure member (14) closes the container (12), and a heat reservoir (18) in thermal contact with the thermal circuit. The heat reservoir (18) can be placed within the container (12) or incorporated into the closure member (14). If incorporated into the closure member (14), the heat reservoir (18) can be placed in direct thermal contact with the thermal circuit or connected to the thermal circuit via a thermal conduit (28). The thermal shield (10) can further comprise a layer (26) of insulating material lining the interior surface of the conductive liner (16). Heat pipes can also be employed as a part of the thermal circuit.
