US Patent 7047634 Method of making a multilayer wiring board
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Patent abstract
A built-in component type multilayer wiring board includes at least one resin layer and at least one frame resin layer. The resin layer includes electronic components buried therein. The frame resin layer includes at least one of glass cloth, filler and nonwoven fabric. The frame resin layer includes no electronic component.
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Patent Inventor Names
Naoki Nakamura0
Date of Patent
May 23, 2006
0Patent Application Number
106649280
Date Filed
September 22, 2003
0Patent Primary Examiner
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US Patent 7047634 Method of making a multilayer wiring board
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