US Patent 7064953 Electronic package with direct cooling of active electronic components
Patent 7064953 was granted and assigned to FormFactor on June, 2006 by the United States Patent and Trademark Office.
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Patent abstract
A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic components of the dies.
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Patent Inventor Names
Charles A Miller0
Date of Patent
June 20, 2006
0Patent Application Number
100264690
Date Filed
December 27, 2001
0Patent Primary Examiner
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US Patent 7064953 Electronic package with direct cooling of active electronic components
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