Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kiyohiro Isogawa0
Takashi Ueda0
Date of Patent
July 4, 2006
0Patent Application Number
110365080
Date Filed
January 12, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device includes a first lead having an inner portion on which a semiconductor chip is mounted, a second lead having an inner portion electrically connected to the semiconductor chip via a wire and a resin package for sealing the semiconductor chip and the wire. The inner portions, the semiconductor chip and the wire are coated with a coating film formed of amorphous fluororesin.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
