US Patent 7081661 High-frequency module and method for manufacturing the same
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Patent abstract
In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the surface of the insulating resin. This metal thin film provides an electromagnetic wave shielding effect.
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Patent Inventor Names
Hideki Takehara0
Kunihiko Kanazawa0
Noriyuki Yoshikawa0
Date of Patent
July 25, 2006
0Patent Application Number
100988950
Date Filed
March 13, 2002
0Patent Primary Examiner
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US Patent 7081661 High-frequency module and method for manufacturing the same
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