US Patent 7084657 Bump and method of forming bump
All edits
Edits on 4 Jan, 2024
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 25 Nov, 2023
Golden AI
Edits made to:
Infobox (+8 properties)
Article (+565 characters)
Article
Patent abstract
A probe card used for establishing electric contact with an electric part to inspect an electric characteristic thereof comprises a plurality of conductors, each transmitting a signal used for inspection, and a plurality of bumps, each formed on one of the plurality of conductors, which are used for establishing mechanical contact with the electric part. Each bump includes a lower portion fusedly arranged on the conductor and an upper portion taperedly formed in such a fashion that a cross section of the bump closer to a tip thereof is smaller.
Infobox
Is a
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shigeru Matsumura0
Date of Patent
August 1, 2006
0Patent Application Number
103457050
Date Filed
January 16, 2003
0Patent Primary Examiner
Golden AI
Edits made to:
US Patent 7084657 Bump and method of forming bump
Find more entities like US Patent 7084657 Bump and method of forming bump
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
