Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hongyu Wang0
Date of Patent
August 8, 2006
0Patent Application Number
109966630
Date Filed
November 24, 2004
0Patent Primary Examiner
Patent abstract
An aqueous composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0.001 to 15 weight percent of a water soluble modified cellulose, non-saccaride water soluble polymer, 0 to 15 weight percent phosphorus compound, 0.005 to 10 weight percent of a water miscible organic solvent, and water.
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