Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yasuyuki Motoshima0
Takahiro Ogawa0
Teruyuki Watanabe0
Toshio Yokoyama0
Akira Owatari0
Kenichi Kobayashi0
Masahiko Sekimoto0
Mitsuru Miyazaki0
...
Date of Patent
August 8, 2006
0Patent Application Number
107123480
Date Filed
November 14, 2003
0Patent Primary Examiner
Patent abstract
The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
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