Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsiang Wei Wang0
Date of Patent
August 8, 2006
0Patent Application Number
107208870
Date Filed
November 24, 2003
0Patent Primary Examiner
Patent abstract
In a damascene process of fabricating an interconnect structure in an integrated circuit, a method for removing separate via layers is disclosed herein, which includes combining the via layers into a single mask.
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