US Patent 7087538 Method to fill the gap between coupled wafers
Patent 7087538 was granted and assigned to Intel on August, 2006 by the United States Patent and Trademark Office.
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Patent abstract
A three-dimensional integrated circuit formed by applying a material to fill a gap between coupled wafers and slicing the coupled wafers into dice. A method for filling a gap between coupled wafers. Various embodiments include at least one of spinning a coupled wafer pair, drilling a hole into one of the coupled wafers, and using a vacuum to aid in the dispersion of the material.
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US Patent 07087538 Method to fill the gap between coupled wafers US Patent 7087538 Method to fill the gap between coupled wafers
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Patent Number
0708753800
Patent Number
708753800
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Current Assignee
Patent Jurisdiction
Patent Number
070875380
Date of Patent
August 8, 2006
0Patent Application Number
109195500
Date Filed
August 16, 2004
0Official Website
Patent Primary Examiner
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
070875380
Date of Patent
August 8, 2006
0Patent Application Number
109195500
Date Filed
August 16, 2004
0Official Website
Patent Primary Examiner
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US Patent 07087538 Method to fill the gap between coupled wafers
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07087538
Date of patent
August 8, 2006
Patent application number
10919550
Date Filed
August 16, 2004
Patent primary examiner
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