Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 8, 2006
Patent Application Number
10898563
Date Filed
July 26, 2004
Patent Primary Examiner
Patent abstract
This invention relates to a resin composition capable of being thermally cured while minimizing or eliminating voids in the resulting composite, the composition having both a long pot life at low temperatures and a fast curing rate at higher temperatures containing a mixture of (a) a phenol-formaldehyde resole resin, and (b) an etherified hardener, the etherified hardener being prepared from an alkoxylated polyol or a mono epoxy functional diluent.
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