Patent attributes
A chip package comprising a lead frame, a chip, a plurality of generic wires, a plurality of AC ground wires, at least a characterized signal wire and an insulation material is provided. The lead frame comprises a die pad, a plurality of generic leads, a plurality of AC ground leads and at least a characterized signal lead structure. Both sides of the characterized signal lead structure are AC ground leads. The characterized signal lead structure has a cross-sectional area perpendicular to the direction where signals transmit, which is larger than that of each generic lead. The chip is attached to the die pad. The generic wires respectively connect the chip to the generic leads. The AC ground wires respectively connect the chip to the AC ground leads. The characterized signal wires connect the chip to the characterized signal lead structure. The characterized signal wires are used for transmitting an identical signal between the chip and the characterized signal lead structure. The insulation material encapsulates the lead frame, the chip, the generic wires, the AC ground wires and the characterized signal wires.
