An electrical module assembly configured for latching engagement with a receptacle assembly adapted for mounting to a printed circuit board includes a release mechanism having at least one actuator arm adapted to extend longitudinally along a respective one of opposite side walls of the receptacle assembly, and the actuator arm includes an ejector tab extending longitudinally therewith. A pivotally mounted bail is selectively positonable between a latched position and an unlatched position, and the bail engages the actuator arm and longitudinally pulls the actuator arm to release the ejector tab from the receptacle assembly.