Patent attributes
Methods and systems for managing bubbles in a micro electro mechanical systems device are described. One exemplary system includes a fluid-feed channel configured to supply fluid to a plurality of ejection chambers, individual ejection chambers comprising a resistor configured to eject fluid from the individual ejection chamber. The system further includes a processor configured to cause an individual resistor to be energized at a first intensity sufficient to eject fluid from a respective ejection chamber, the processor further configured to cause the resistor to be energized at a second lower intensity which heats the resistor but does not cause fluid to be ejected from the respective ejection chamber, and wherein the processor can energize, at the second lower intensity level, individual resistors in a pattern designed to detach a bubble from a surface defining a portion of the fluid-feed channel.
