Patent attributes
The present invention suggests thermoplastic polymer particles for molding, which can solve all at once the problem of fine powder caused by suspension polymerization process, the problem of reducing energy consumption when drying caused by emulsion polymerization process and the problem of the compounding process for processors, and a process for preparing the same. 100 parts by weight of polymer particles having an average particle size of 50 to 500 μm prepared by suspension polymerization are coated with 22 to 100 parts by weight of an emulsion polymer prepared by emulsion polymerization. A polymer suspension comprising the polymer having an average particle size of 50 to 500 μm prepared by suspension polymerization and a polymer latex prepared by emulsion polymerization are mixed in a proportion of 22 to 100 parts by weight of the emulsion polymer based on 100 parts by weight of the suspension polymer. After the solid content concentration of the polymer particles within the suspension of the polymer mixture is adjusted to 25 to 35% by weight, the mixture is contacted with an electrolytic aqueous solution at the Vicat softening temperature of the emulsion polymer or lower. Then, after heating to the Vicat softening temperature of the emulsion polymer or higher, the polymer particles are recovered by solid-liquid separation.
