Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 22, 2006
Patent Application Number
10027856
Date Filed
October 19, 2001
Patent Primary Examiner
Patent abstract
A semiconductor device and a method of making a semiconductor device are provided, wherein the device includes a die-pad, a semiconductor chip and a sealing resin. The die-pad has a first surface and a second surface opposite to the first surface. The second surface includes an exposed portion and a retreated portion around the exposed portion. The semiconductor chip is mounted on the first surface of the die-pad. The sealing resin covers the die-pad and the semiconductor chip, exposes the exposed portion, and is held in contact with the retreated portion.
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