Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Atsushi Nakamura0
Yuichi Mabuchi0
Motoo Suwa0
Hideshi Fukumoto0
Date of Patent
August 22, 2006
0Patent Application Number
109394910
Date Filed
September 14, 2004
0Patent Primary Examiner
Patent abstract
A semiconductor device has a reduced number of external power terminals and is scaled down while suppressing power noise, and an electronic device is efficiently equipped with a bypass condenser. A package substrate has, on its surface, a semiconductor chip having a plurality of output circuits and at least one electrode for supplying a voltage to each of the output circuits, and is provided with external terminals on its back surface and has a plurality of wiring layers.
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