Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Michael Warner0
Hung-ming Wang0
John W. Smith0
Masud Beroz0
David Light0
Delin Li0
Dennis Castillo0
Date of Patent
August 29, 2006
Patent Application Number
10699328
Date Filed
October 31, 2003
Patent Primary Examiner
Patent abstract
A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
