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US Patent 7100954 Ultra-thin wafer handling system

Patent 7100954 was granted and assigned to Nexx Systems on September, 2006 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee
‌
Nexx Systems
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7100954
Date of Patent
September 5, 2006
Patent Application Number
10618091
Date Filed
July 11, 2003
Patent Citations Received
‌
US Patent 11935778 Holding mechanism including Bernoulli pad
0
Patent Primary Examiner
‌
Donald Underwood
Patent abstract

An improved Bernoulli end effector for holding, handling, and transporting ultra-thin substrates includes edge guides to aid in the positioning of the substrate and may include friction pads that impede motion of the substrate lifted by the end effector. The Bernoulli end effector may be incorporated into an apparatus and method for supinating a substrate so that both surfaces of the substrate can be processed. In addition, the Bernoulli end effector may be used to place ultra-thin substrates on and retrieve substrates from a substrate handling structure that includes weights that prevent the substrates from bowing or flexing during processing and includes guides that prevent the ultra-thin substrates from moving or translating on the surface of the substrate handling structure.

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