Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Laurent S. Vesier0
John V. H. Roberts0
Date of Patent
September 5, 2006
Patent Application Number
10673002
Date Filed
September 26, 2003
Patent Primary Examiner
Patent abstract
A resilient, laminated polishing pad for chemical mechanical polishing is disclosed. The polishing pad includes a base layer and a polishing layer bonded by a hot-melt adhesive. The hot-melt adhesive of the present invention provides a Tpeel strength for the polishing pad of at least greater than 40 Newtons at 305 mm/min, reducing pad delamination.
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