Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 12, 2006
0Patent Application Number
101653560
Date Filed
June 6, 2002
0Patent Citations Received
Patent Primary Examiner
Patent abstract
New methods for fabrication of silicon microstructures have been developed. In these methods, an etching delay layer is deposited and patterned so as to provide differential control on the depth of features being etched into a substrate material. Compensation for etching-related structural artifacts can be accomplished by proper use of such an etching delay layer.
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