Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Koichi Kishiro0
Date of Patent
September 12, 2006
0Patent Application Number
107611870
Date Filed
January 22, 2004
0Patent Primary Examiner
Patent abstract
A resist pattern formed so as to expose a wafer edge region is used to expose an edge surface region of an Si support substrate by dry etching. Next, a conductive layer constituted as wirings by subsequent patterning is formed by sputtering.
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