US Patent 7105597 Resin aqueous dispersion composition

The present invention provides a resin aqueous dispersion composition comprising water and at least one kind of resin particle, wherein when a primary average particle of each resin particle is taken as a sphere of the same volume, a nonionic surfactant is present in the composition in an amount which occupies 75 to 95% of a theoretical void among resin particles of 26% when each resin particle is arranged in a close packed structure. The nonionic surfactant is a solvent which is substantially nonvolatile in a temperature range of up to 100° C. and evaporates or thermally decomposes at a temperature lower than the thermal decomposition temperature of the resin particles. The resin aqueous dispersion composition can be coated thickly and can prevent development of mud crack.