US Patent 7107674 Method for manufacturing a chip carrier
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Patent Inventor Names
Kia Silverbrook0
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Patent abstract
A method of manufacturing an integrated circuit carrier includes providing a substrate. At least one receiving zone for an integrated circuit is demarcated on the substrate. A plurality of island-defining portions is arranged about each of the receiving zones. Rigidity-reducing arrangements are created between neighboring island-defining portions by removing material from the substrate.
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US Patent 07107674 Method for manufacturing a chip carrier US Patent 7107674 Method for manufacturing a chip carrier
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Patent Number
071076740
Patent Number
71076740
Edits on 7 Apr, 2023
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Patent Jurisdiction
Patent Number
071076740
Date of Patent
September 19, 2006
0Patent Application Number
108933790
Date Filed
July 19, 2004
0Official Website
Patent Primary Examiner
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US Patent 07107674 Method for manufacturing a chip carrier
Infobox
Is a
Patent jurisdiction
Patent number
07107674
Date of patent
September 19, 2006
Patent application number
10893379
Date Filed
July 19, 2004
Patent primary examiner
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