Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Fabrizio Montauti0
John C. Zarganis0
Rocky R. Arnold0
Date of Patent
September 19, 2006
0Patent Application Number
108257470
Date Filed
April 15, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.
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