Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
September 19, 2006
Patent Application Number
10823725
Date Filed
April 13, 2004
Patent Primary Examiner
Patent abstract
A semiconductor device that enables a test for individual IC chips mounted on an interposer is provided. In the semiconductor device having the interposer on which a first IC chip and a second IC chip are mounted, the first IC chip and the second IC chip are connected to outside the interposer by input wring and output wiring, respectively, and a transistor element serving as a switch is inserted in series into the wiring connecting between the first IC chip and the second IC chip.
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