Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mai Akiba0
Yasuyuki Arai0
Date of Patent
September 26, 2006
Patent Application Number
10793787
Date Filed
March 8, 2004
Patent Primary Examiner
Patent abstract
The present invention provides a semiconductor device using a support of new form which can further expand the range of design and enlarge a circuit size while restraining volume of a substrate than a flexible flat-plate substrate. A method for manufacturing a semiconductor device comprising the steps of: forming an insulating film on a fibrous support; forming a semiconductor film so as to be in contact with the insulating film; and forming a semiconductor device using the semiconductor film; wherein the step of forming the insulating film or the step of forming the semiconductor film is performed with the support rotating, using a rotational axis parallel to a longitudinal direction of the support as a center.
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