Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Karl Heinz Priewasser0
Date of Patent
October 3, 2006
Patent Application Number
10947242
Date Filed
September 23, 2004
Patent Primary Examiner
Patent abstract
To facilitate handling a wafer during processing even when the wafer is formed thin, a protective member is stuck through an adhesive agent to an outer-peripheral surplus region of a front surface of the wafer, the region being formed with no individual devices, and a back surface of the wafer is ground in a state where the whole front surface of the wafer is supported by the protective member. Since an outer periphery of the wafer is reinforced by the protective member, the wafer can be easily handled even after having been thinned by the grinding.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
