Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Toshihiro Mori0
Date of Patent
October 10, 2006
0Patent Application Number
107739230
Date Filed
February 5, 2004
0Patent Primary Examiner
Patent abstract
This invention is intended to connect a dummy lead while preventing depression of a resin that seals electric connection sections, without bringing the dummy lead into contact with a recording element substrate or without taking the dummy lead for a lead electrode. The dummy lead which is provided inward of an opening of a flexible film wiring substrate to be shorter than the lead electrode, and which is not electrically connected to an electrode pad is provided to be adjacent to the lead electrode.
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