Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 10, 2006
Patent Application Number
10994500
Date Filed
November 22, 2004
Patent Primary Examiner
Patent abstract
A method for performing immersion lithography on a semiconductor wafer is disclosed. The method includes positioning the semiconductor wafer beneath a lens and applying a fluid between a top surface of the semiconductor wafer and the lens. An additive can be provided to the top surface so that any droplet of the fluid that forms on the top surface of the semiconductor wafer will have a contact angle between about 40° and about 80°.
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