Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Dong-Mau Wang0
Date of Patent
October 17, 2006
Patent Application Number
11024719
Date Filed
December 30, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention relates to a radiator sheet improvement and more particularly to a structure with enhanced strength and increased heat exchange surface after assembling, which is achieved first by forming large holes and adjacent small holes on each radiator sheet, wherein a radiator tube passing through each large hole and a solder rod or tin solder inserted into each small hole, and then by using heat to melt solder to fill the space between the radiator sheet and the radiator tube, thereby enabling a firm bonding effect therebetween.
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