US Patent 7124931 Via heat sink material
Patent 7124931 was granted and assigned to Intel on October, 2006 by the United States Patent and Trademark Office.
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Patent Inventor Names
J. Shelton Lewis0
John Oldendorf0
Michael Kochanowski0
Shawn Lloyd0
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Patent abstract
The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.
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US Patent 07124931 Via heat sink material US Patent 7124931 Via heat sink material
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Patent Number
071249310
Patent Number
71249310
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071249310
Date of Patent
October 24, 2006
0Patent Application Number
107173480
Date Filed
November 18, 2003
0Official Website
Patent Primary Examiner
Edits on 7 Jun, 2022
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US Patent 07124931 Via heat sink material
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07124931
Date of patent
October 24, 2006
Patent application number
10717348
Date Filed
November 18, 2003
Patent primary examiner
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