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US Patent 7125744 High-frequency module and method for manufacturing the same

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Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Hideki Takehara0

Kunihiko Kanazawa0

Noriyuki Yoshikawa0

Date of Patent

October 24, 2006

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Patent Application Number

109601610

Date Filed

October 6, 2004

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Patent Citations Received

US Patent 12009343 Stackable package and method

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US Patent 11855023 Wafer level fan out semiconductor device and manufacturing method thereof

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US Patent 11942581 Semiconductor device with transmissive layer and manufacturing method thereof

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Patent Primary Examiner

0

Patent abstract

In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the surface of the insulating resin. This metal thin film provides an electromagnetic wave shielding effect.

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