Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yiu Fai Kwan0
Wai Chan0
Date of Patent
October 24, 2006
0Patent Application Number
109947900
Date Filed
November 22, 2004
0Patent Primary Examiner
Patent abstract
A leadframe having a metallic substrate and comprising layers of plated material, and a method of manufacturing said leadframe are provided. The substrate is plated with a layer of oxidizable material comprising nickel and a noble metal is selectively plated on the layer of oxidizable material. Thereafter, an exposed portion of the oxidizable material that is not plated with the noble metal is passivated to enhance adhesion of an encapsulation compound molded to the leadframe.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
