Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jung-Sung Shih0
Chin-Ming Chen0
Wei-Fang Wu0
Yu-Hung Huang0
Date of Patent
October 31, 2006
0Patent Application Number
109816970
Date Filed
November 5, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.
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