Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 31, 2006
Patent Application Number
10761477
Date Filed
January 20, 2004
Patent Primary Examiner
Patent abstract
An electropolishing method for removing potential device-contaminating particles from a wafer, is disclosed. The method includes immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis. The method is effective in removing particles from via openings of all sizes, including via openings having a width smaller than about 0.2 μm.
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