Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
October 31, 2006
Patent Application Number
11073074
Date Filed
March 4, 2005
Patent Primary Examiner
Patent abstract
The present invention relates to an image sensor with a microlens and a method for fabricating the same with use of a bump formation process. A method for fabricating an image sensor includes the steps of: forming a passivation layer on a substrate structure provided with a photodiode and other various device elements; forming a microlens on a portion of the passivation layer; forming a microlens passivation layer for protecting the microlens from a subsequent bump formation process on the microlens; forming a pad open region by selectively etching the microlens passivation layer and the passivation layer; and forming a bump in the pad open region.
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