US Patent 7129732 Substrate test apparatus and method of testing substrates

Patent 7129732 was granted and assigned to Endicott Interconnect Technologies, Inc. on October, 2006 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

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Endicott Interconnect Technologies, Inc.

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

71297320

Patent Inventor Names

Kevin T. Knadle0

Date of Patent

October 31, 2006

Patent Application Number

112814560

Date Filed

November 18, 2005

Patent Citations Received

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US Patent 11940481 Electrical connection test for unpopulated printed circuit boards

Patent Primary Examiner

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Paresh Patel

Patent abstract

A test apparatus for testing circuitized substrates such as PCB test coupons for thru-hole failure in which the substrate may be cooled to a temperature less than the ambient temperature surrounding the test apparatus housing in which the testing is accomplished. A method of testing substrates is also provided.

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