Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
James D. Cook0
Date of Patent
October 31, 2006
0Patent Application Number
108957860
Date Filed
July 20, 2004
0Patent Primary Examiner
Patent abstract
Sensor package systems and methods are disclosed, which include a quartz sensor package encapsulated by an overmold material. A surface acoustic wave sensing element and one or more bonding pads can be integrated with the quartz sensor package. Additionally, one or more antennas can be respectively bonded to the quartz sensor package at the bonding pads, such that the antennas communicates electrically with the surface acoustic wave sensing element and permits wireless interrogation of the quartz sensor package including the surface acoustic wave sensing element from an external wireless source.
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