US Patent 7131194 Method of manufacturing a device
Patent 7131194 was granted and assigned to Seiko Epson on November, 2006 by the United States Patent and Trademark Office.
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Patent Inventor Names
Takashi Hashimoto0
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Patent abstract
Wirings 2B1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent property, bonding an insulating layer 4B1 to the wirings 2B1 with an adhesive material 3B1 therebetween, peeling and removing the provisional substrate 5, and bonding and fixing the wirings 2B1 together with the insulating film 4B1 to a main substrate 1 by an adhesive material 3B1.
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US Patent 07131194 Method of manufacturing a device US Patent 7131194 Method of manufacturing a device
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Patent Number
071311940
Patent Number
71311940
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Patent Jurisdiction
Patent Number
071311940
Date of Patent
November 7, 2006
0Patent Application Number
104205220
Date Filed
April 22, 2003
0Official Website
Patent Primary Examiner
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US Patent 07131194 Method of manufacturing a device
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07131194
Date of patent
November 7, 2006
Patent application number
10420522
Date Filed
April 22, 2003
Patent primary examiner
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