Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 7, 2006
Patent Application Number
10639348
Date Filed
August 12, 2003
Patent Primary Examiner
Patent abstract
Solder bump pads are formed on a semiconductor substrate by way of a semiconductor template that has been micromachined to receive solder paste material. The solder paste material is then formed into precisely controlled ball shapes and geometries.
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