Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Haremi Ito0
Shinji Murahata0
Keiji Matsumoto0
Date of Patent
November 7, 2006
Patent Application Number
10250572
Date Filed
October 22, 2002
Patent Primary Examiner
Patent abstract
In a die for molding a honeycomb structure, in which a coating layer is formed on a die base so that slits with a particular width are provided, the slits are provided so as to have a width of 30 to 200 μm by forming the coating layer by a substrate layer with a thickness of 10 to 100 μm and a surface layer with a thickness of 1 to 30 μm. Further, the substrate layer is formed by a metal layer containing no oxide.
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