Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Heping Yue0
Michael A. Lamson0
Date of Patent
November 7, 2006
0Patent Application Number
104115310
Date Filed
April 10, 2003
0Patent Primary Examiner
Patent abstract
A semiconductor package having a plurality of conductors arrayed in two (or more) parallel planes, and an available ground conductor. Conductors in the auxiliary or second plane substantially overlay the primary signal conductors in the first plane, and the impedance of any lead or lead pair is arbitrarily set at the assembly process by connecting the auxiliary conductors to ground or by leaving them floating. Differential pairs of signal conductors, either odd or even mode are set by connecting the auxiliary conductors to a ground contact.
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