Patent 7134905 was granted and assigned to Yazaki North America on November, 2006 by the United States Patent and Trademark Office.
A wire harness with a housing, a circuit board, terminals, wires and a cover. The housing is formed of an electrically insulating material and has a cavity and a plurality of channels that extend between an exterior surface of the housing and the cavity. The circuit board is disposed in the cavity and includes board terminals. The terminals are coupled to the housing and the circuit board and have a first portion, which is electrically coupled to an associated one of the board terminals, and a second portion that is received into an associated one of the channels. The cover is coupled to the housing and confines the circuit board within the cavity. The wires are inserted into the second portion of a corresponding one of the terminals to electrically couple the terminals and the wires. A method for forming a wire harness is also provided.