US Patent 7135763 Technique for attaching die to leads
Patent 7135763 was granted and assigned to Micron Technology on November, 2006 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
July 25, 2002
Date of Patent
November 14, 2006
Patent Application Number
10205940
Patent Inventor Names
Hugh E. Stroupe
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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